SDM-1115G4L
M/B MTGU3AL-SI
- Intel® Core™ i3-1115G4 Processor
- Dual Channel DDR4, 2 x SO-DIMMs
- 1 x GbE LAN Port
- 3 x USB3.0 Ports
- 1 x USB2.0 Port
- Environment : Operation 0~55°C
- Long life time support
- Support 4K/60Hz, HDCP v2.2
FORM FACTOR |
SDM-Large, 175W x 100D(mm) |
---|---|
CPU |
Intel® Core™ i3-1115G4 Processor
10nm SuperFin, 2 cores, 4 threads, up to 4.10 GHz
TDP 28W
|
SOCKET | 1 x FCBGA1449 |
MEMORY |
2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules
|
ETHERNET | 1 x GbE LAN port (Intel® i219V) |
VIDEO |
Integrated Graphics Processor - Intel® UHD Graphics:
1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz
(4 independent display outputs)
|
AUDIO | Intel® integrated Audio |
EXPANSION SLOTS |
1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-Key
|
REAR I/O |
1 x RJ45 LAN port
2 x HDMI
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Holes (Optional)
1 x Reset button
1 x Power button
|
TPM | 1 x TPM header |
OS COMPATIBILITY | Windows® 10 (x64) |
CHIPSET | SoC |
OPERATING PROPERTIES |
Operating temperature: 0°C to 55°C
Operating humidity: 0%-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
|
PACKAGING CONTENT |
Box Packing Capacity: 10pcs
Carton size: 465 x 351 x 217(mm)
Content:
Screw Kit With #0 Ziplock Bag Screw-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
|
ORDER INFORMATION | 9MTGU3ALMR-SI (Box packing) |