SDM-1115G4L

M/B MTGU3AL-SI

  • Intel® Core™ i3-1115G4 Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 1 x GbE LAN Port
  • 3 x USB3.0 Ports
  • 1 x USB2.0 Port
  • Environment : Operation 0~55°C
  • Long life time support
  • Support 4K/60Hz, HDCP v2.2
  • Intel® Platform Trust Technology (PTT) 3.0
FORM FACTOR

SDM-Large, 175W x 100D(mm)

CPU
Intel® Core™ i3-1115G4 Processor
10nm SuperFin, 2 cores, 4 threads, up to 4.10 GHz
TDP 28W
MEMORY
2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules
ETHERNET 1 x GbE LAN port (Intel® i219V)
VIDEO
Integrated Graphics Processor - Intel® UHD Graphics:
1 x HDMI 2.0 (SDM), supporting a maximum resolution of 4096x2160 @60Hz
1 x Display Port (SDM), supporting a maximum resolution of 4096x2160 @60Hz
2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz
(4 independent display outputs)
AUDIO Intel® integrated Audio
EXPANSION SLOTS
1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-Key
INTERNAL I/O
1 x RJ45 LAN port
2 x HDMI 2.0
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Hole (Optional)
1 x Reset button
1 x Power button
REAR I/O
1 x RJ45 LAN port
2 x HDMI 2.0
3 x USB 3.2 Gen 1
1 x USB 2.0
1 x PWR LED
1 x HDD LED
2 x External Antenna Hole (Optional)
1 x Reset button
1 x Power button
TPM 1 x TPM header
OS COMPATIBILITY Windows® 10 (x64)
CHIPSET soc
OPERATING PROPERTIES
Operating temperature: 0°C to 55°C
Operating humidity: 0%-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
PACKAGING CONTENT
Box Packing Capacity: 10pcs
Carton size: 465 x 351 x 217(mm)
Content:
SCREW KIT WITH #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
ORDER INFORMATION 9MTGU3ALMR-SI (Box packing)